2篇
您的检索式：作者名="Haoshu Tan"
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| 1 | The mass and heat transfer process through the door seal of refrigeration显示文摘As one of the main reasons causing leakage heat load in a refrigerator,mass and heat transfer through refrigerator door seal is of great importance to be studied.In this paper,a model is presented for numerical simulation of mass and heat transfer process through refrigerator door seal,and an experiment apparatus is designed and set up as well for comparison.A two-dimensional model and tracer gas method are used in simulation and experiment,respectively.It can be found that the relative deviations of air infiltration rate between the simulated results and experimental results were less than 1%,and the temperature difference errors at two special points of the door seal were less than 2.03℃.In conclusion,the simulated results are in good agreement with the experimental results.This paper initially sets up a model that can accurately simulate the heat and mass transfer through the refrigerator door seal,and the model can be used in refrigerator door seal optimization research in the follow-up study. | Haoshu Tan Xinzhou Song Ying Zhang Maogang He | 2017 | Chinese Journal of Chemical Engineering2017，25，8： | 3 |
| 2 | A Model to Evaluate the Device-Level Performance of Thermoelectric Cooler with Thomson Effect Considered显示文摘In this paper,a one-dimensional thermodynamic model was developed to evaluate the device-level performance of thermoelectric cooler(TEC)with the Thomson effect,contact resistance,gap heat leakage,heat sink,and heat load taken into account.The model was generalized and simplified by introducing dimensionless parameters.Experimental measurements showed good agreement with analytical results.The parametric analysis indicated that the influence of the Thomson effect on cooling capacity continued to expand with increasing current,while the effect on COP hardly changed with current.Low thermal contact resistance was beneficial to obtain lower hot-junction temperature,which can even reduce 2 K compared with the electrical contact resistance in the case study.The gap heat leakage was a negative factor affecting the cooling performance.When the thermal resistance of the heat sink was small,the negative effect of heat leakage on performance would be further enlarged.The enhancement of heat load temperature would increase the cooling power of the TEC.For example,an increase of 5 K in heat load can increase the cooling capacity by about 4%.However,once the current exceeded the optimum value,the raising effect on the cooling power would be weakened.The research can provide an analytical approach for the designer to perform trade studies to optimize the TEC system. | GONG Tingrui GAO Lei WU Yongjia TAN Haoshu QIN Feng XIN Xiong SHEN Limei LI Juntao MING Tingzhen | 2022 | Journal of Thermal Science2022，31，3： | 0 |
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